Edge Defect Inspection Device "RXW Series"
Unique laser application technology and sensor/image processing technology! Equipment dedicated to silicon wafers.
The "RXW Series" is a dedicated edge defect inspection device for silicon wafers that utilizes unique laser application technology along with sensor and image processing technology. It meets the diverse inspection, dimensional measurement, and automatic sorting requirements for edge proximity areas demanded in both wafer manufacturing and device manufacturing processes. We offer models such as the "RXW-1200D" and "RXW-1200F" that are compatible with device manufacturing processes. 【Features】 <RXW-1200D> ■ Full circumference image acquisition and ADC functionality using a laser sensor ■ Dark field switching function that enables high-sensitivity inspection ■ Border measurement function after EBR ■ Inspection and measurement after edge trimming, bonding, and sintering in CIS/TSV processes ■ ADR function with a high-magnification AF color camera *For more details, please refer to the PDF document or feel free to contact us.
- Company：オプティマ https://www.optima-1.co.jp/
- Price：Other
